Users can leverage the seamless workflow of Electronics Desktop, which includes advanced electromagnetic field solvers, and dynamically link them to power circuit simulators to predict the EMI/EMC performance of electrical devices. These integrated workflows eliminate the need for repetitive design iterations and costly EMC certification testing. Multiple EM solvers designed to address various electromagnetic issues, along with the circuit simulators in Electronics Desktop, help engineers evaluate the overall performance of their electrical devices and create interference-free designs. These issues range from radiated and conducted emissions, susceptibility, crosstalk, RF detection, RF coexistence, co-site, electrostatic discharge, electrical fast transients (EFT), lightning effects, high-intensity radiated fields (HIRF), radiation hazards (RADHAZ), electromagnetic environmental effects (EEE), electromagnetic pulses (EMP), to shielding effectiveness and other EMC applications.

The powerful analysis engine of EMIT calculates all important RF interactions, including the nonlinear effects of system components. Diagnosing radio frequency interference (RFI) in complex environments is notoriously difficult and expensive to perform in a test environment, but thanks to EMIT’s dynamic linked result views, identifying the root cause of any interference is quickly done through graphical signal tracing and diagnostic summaries that show the exact origin and path that interference signals take to reach each receiver. Once the cause of the interference is discovered, EMIT allows for the rapid evaluation of different interference mitigation measures to find the optimal solution.

The new HFSS/EMIT data link enables the creation of the RFI analysis model in EMIT directly from the 3D physical model of the installed antennas in HFSS. This enables a seamless end-to-end workflow for a complete RFI solution for RF environments, ranging from cosite interference in large platforms to receiver desensitization in electronic devices.

A candidate network design can examine the input impedances of all elements in any beam scanning condition. Phased array antennas can be optimized in terms of performance at the element, sub-array, or full network level based on element matching (passive or driven) and the far-field and near-field pattern behavior in any scanning condition of interest. Modeling an infinite array involves one or more antenna elements placed in a unit cell. The cell contains periodic boundary conditions on the surrounding walls to reflect the fields, thereby creating an infinite number of elements. The scanning impedance of the elements and the radiation patterns of the integrated elements can be calculated, including all mutual coupling effects. This method is particularly useful for predicting blind scanning angles that may occur under certain beam orientation conditions. The finite array simulation technology relies on domain decomposition with the unit cell to achieve a fast solution for large finite-sized arrays. This technology enables a comprehensive network analysis to predict all mutual couplings, scanning impedance, element models, array models, and array edge effects.

It includes EMIT, a unique multifidelity approach to predict the performance of RF systems in complex RF environments with multiple sources of interference. EMIT also provides the necessary diagnostic tools to quickly identify the root causes of radio frequency interference (RFI) issues and mitigate them early in the design cycle.

HFSS with SI Circuits can handle the complexity of modern chip-to-chip interconnection design across integrated circuits, enclosures, connectors, and printed circuit boards. By leveraging HFSS’s advanced electromagnetic field simulation capabilities, dynamically linked to powerful circuit and system simulation, engineers can understand the performance of high-speed electronic products long before building a hardware prototype.

The ability to simulate encrypted HFSS 3D components means that there’s no longer a need to compromise on accuracy. Designers are no longer required to use circuit-level components (e.g., S-parameter models) instead of actual 3D models in their designs, which would impact the overall accuracy of the simulation.

This capability allows potential clients of component suppliers to use encrypted 3D components in the design of a complete system. The end user gains greater confidence in the validity of the results due to a rigorous consideration of coupling effects from integration, while also protecting the supplier’s design intellectual property. Additionally, it provides full, uncompromised simulation fidelity for encrypted 3D components with HFSS, using adaptive meshing to ensure reference-level accuracy.

The HFSS multipaction solver is based on a finite element particle-in-cell (PIC) method. HFSS provides multipaction analysis as a post-processing step for field solutions in the frequency domain. With just a few configuration steps for excitations and boundary conditions for simulating charged particles, you can verify whether your design meets the multipaction breakdown prevention standard.